By Jeff Eckert View In Digital Edition
Topics discussed include another “breakthrough” in fusion technology that promises to provide the world with clean, safe, cheap, inexhaustible power; technology that combines a microelectromechanical system (MEMS) with newly crafted metasurface lenses to produce a much more compact infrared light-focusing system; machines based on Intel’s “Skylake” Xeon Scalable Processor (Xeon SP) that span rack-and-blade units for several markets; the latest bare-bones model Raspberry Pi 3 Model B+; NXP Semiconductors will soon be offering its first IoT-on-a-chip device, which “significantly advances the future of edge computing;” Zink Holdings has incorporated a Zink printer into its POP 20 MP digital camera to produce 3.5 x 4.25 in Polaroid-style prints; successful creation of a stethoscope produced entirely with 3D printed parts and recycled plastic tubing; and IBM has again scored the top number of US patents.
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